English/Production/Key data
Production: Key data
Connection technology:
- Adhesion
- Adhesion stencil printing
- High speed dispensers - Soldering
- Double wave soldering under nitrogen
- Reflow soldering under nitrogen
- Vapour phase soldering (for special cases) - Stencil printing
- 585mm x 585mm stencil frame
- Printing area approx. 400mm x 400mm
Components:
Processing of the following designs:
- Assembly of all conventional designs
- Special designs
- SMD chips starting at 0402
- ICs up to 55mm
- Pitch spacing up to 0.4mm
- BGA
Programming of all conventional circuits:
- PROM, EPROM, EEPROM, FLASH
- PALs, GALs, EPLDs, microcontrollers
- Special component adaptors available upon request
- Operation and set programmers
- Programming with Sprint Expert, MQP S2000
Circuit boards:
- Dimensions:
- min. 50 x 50mm
- max. 460 x 460mm (X x Y)
Downloads:
| File | File Size | ||
| Datenblatt | DB_Fertigung_1v3.pdf | 1.1 MB |  |
| Praesentation | Vorstellung_Produktion-2010.pdf | 2.8 MB | |
Our capacity:
- 3-shift operation from Monday to Sunday
- 3,000,000 SMD components per week
- 2 SMD lines (Siplace)
- capacity can be increased by 25% in the short-term
Our qualifications:
- Certified management system according to
- DIN EN ISO 9001
- DIN EN ISO 14001